SK hynix breaks ground on US AI-memory hub

SK hynix began construction of an advanced-packaging facility in West Lafayette, Indiana. The company expects to invest more than US$4 billion, open the cleanroom by October 2028 and begin mass production of next-generation high-bandwidth memory in the second half of 2029. A joint R&D testbed with Purdue University will support packaging development and prototyping.

Impact: HBM is a critical constraint for accelerator systems. US packaging capacity can improve supply resilience, but the production start is three years away and execution depends on construction, equipment, workforce and market conditions.

SK hynix | a report